During a presentation at IFA 2025, Deebot parent company Ecovacs (full disclosure: travel and lodging were paid by Ecovacs, but Gizmodo did not guarantee any coverage as a condition of accepting the trip) said repeatedly that its new X11 OmniCyclone robot vacuum‘s AI smarts are all on-device. Or the bulk of them are, anyway. I returned to the booth later and spoke with a couple of the company’s representatives to try to figure out exactly how divorced from the cloud the Deebot X11 OmniCyclone truly is—is it an all-on-device experience, like the Matic robot vacuum, or does it still need an internet connection to keep its best functionality?
The Deebot X11 OmniCyclone’s promise is that it can use local AI smarts to do things like identify spills and messes on the floor and decide how best to clean them, and if mopping is required, what kind of mopping solution to use (the X11’s charging dock holds a couple of options). It can also learn from your routine, shifting and morphing its cleaning schedule and approach over time to suit your behavior.
You, the owner, can talk to the AI Agent Yiko—the company’s name for its refreshed, generative AI-powered vacuum assistant—and give it some pretty broad, natural-language requests, at least according to Ecovacs. I didn’t get to test this out. I wanted to know how broad. Can you say, “Hey Yiko, only clean the bedroom on Fridays,” and it works? Ecovacs’s folks said yes. What about, “Hey Yiko, please clean up around my dining room table at 7 p.m. every night.” Yep, that’s apparently possible, too, although the rep told me you might need to name that table in the Ecovacs Home app and call it by that specific name when you speak your request. Again, I didn’t get to test any of this.
Not that it would matter if your internet went down—in that case, you’d lose a lot of functionality, according to the reps. The app would no longer work because it bounces through Ecovacs’ cloud infrastructure in the U.S. to do that. No more tapping around to tell the robot to clean specific rooms, or remotely controlling it from your smartphone, or seeing cloud-saved videos recorded while you were doing that. It also means no Yiko, because the device’s generative AI voice assistant is cloud-dependent, too.
But there’s a way to use the robot vacuum in which that doesn’t matter. There’s an “Agent Hosting” mode in the Ecovacs Home app where you can switch the Deebot X11 OmniCyclone to AI-only control, essentially putting all of your faith in it to clean your house properly. It might be able to do so, at least according to Ecovacs, which says it can recognize over 100 different categories of objects, as small as a grain of sand. If you switch it to that mode and find that it does just fine at cleaning your house, with no input from you, then you may never bother with the app again. And if that’s the case, you might never know when your internet is out or that the Deebot X11 OmniCyclone has lost its connection to your network.
That doesn’t mean the robot would be useless. Ecovacs’s reps told me that without an internet connection, the Deebot X11 OmniCyclone’s onboard AI would still do its thing, sliding its schedule around as needed, identifying messes, and switching up its cleaning approach as it goes along. I asked if the company sees a future where even the AI voice assistant is on-device, and the reps weren’t sure.
It’s not all the way to the world I want to see, where my smart home devices never need an internet connection to bring me their full feature set, or close enough to it for blues. But it is an encouraging move in that direction, assuming it all works the way Ecovacs says it will. And, with AI, that can be a big “if.”
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![IBM Crosses One of Computing’s Biggest Barriers With World’s First Sub-1 Nanometer Chip
In a major breakthrough, IBM revealed the world’s first semiconductor chip technology built on a sub-1 nanometer chipmaking process. For comparison, the process uses transistor features smaller than the width of a DNA strand, which measures about 2.5 nanometers across. The chip itself is about the size of a fingernail but holds almost 100 billion transistors, and the company expects it could enter markets as early as the next five years. In a statement released today, IBM said the new chip features nearly twice the density of its 2-nanometer chip, released in 2021. According to an accompanying technical report, the chip also demonstrated up to 70% greater energy efficiency than its predecessor. In designing the chip, researchers developed an “entirely new transistor architecture” called nanostack, which “vertically stacks and staggers transistors” to enable IBM’s 0.7-nanometer chip technology, IBM explained. A section of the chip seen with a transmission electron microscope. Credit: IBM “With our new nanostack architecture, we’re not just making smaller transistors,” Jay Gambetta, director of IBM Research, said in the statement. “We’re reinventing how chips are built to deliver dramatically more power and energy efficiency.”
Smaller and smaller Semiconductor chips enable things like computers, home appliances, communications, and transportation devices. In 1965, Intel co-founder Gordon Moore surmised that transistor capacities evolved at a predictable and consistent rate. Specifically, all things considered, the number of transistors on a semiconductor chip would double about every two years. For a while, the so-called Moore’s Law held rather well—until, that is, things hit a literal wall.
“Moore’s Law was never meant to last forever,” according to a blog post by the Massachusetts Institute of Technology’s (MIT) Computer Science and Artificial Intelligence Lab. “Transistors can only get so small and, eventually, the more permanent laws of physics get in the way.” That is, as companies try to cram more transistors into smaller chips, new advances in transistor technology take longer than two years, so Moore’s Law has been over since at least 2016, Charles Leiserson, a computer scientist at MIT, said in the blog. Accordingly, the issue now is to consider how improvements in chip performance fit into a longer-term picture, Willy Shih, an economist at Harvard Business School, said in an explainer.
Reaching atomic levels In that sense, IBM’s latest chip represents an inventive approach for bypassing the limits of physical scaling. Specifically, two wafers with nanosheet-style transistors are glued together like a sandwich to vertically stack two layers of transistors, and related technical assessments suggested that the wafer stacking was flexible and scalable enough to support real computation, Huiming Bu, vice president of IBM’s silicon technology research team, said in a press briefing on the chip. Researcher holding IBM’s sub-1 nm node wafer. Credit: IBM That said, this chip isn’t quite ready for manufacturing just yet. The company’s goal is to enter production in the next five years, but there’s still work to be done. For instance, Bu pointed out that the team was still working on pathways to prevent thermal noise or integration into existing systems in the high-performance computing community. “From my perspective, I hope to see it be as successful as the 2-nanometer [chip] and become the industry platform,” Gambetta said during the briefing. “And as we see with AI and classical computing in general, we are only seeing more and more consumption.” #IBM #Crosses #Computings #Biggest #Barriers #Worlds #Sub1 #Nanometer #ChipIBM,Semiconductors,transistors](https://gizmodo.com/app/uploads/2026/06/nanostacking-ibm-sub-nm-chip-1280x720.jpg "IBM Crosses One of Computing’s Biggest Barriers With World’s First Sub-1 Nanometer Chip
In a major breakthrough, IBM revealed the world’s first semiconductor chip technology built on a sub-1 nanometer chipmaking process. For comparison, the process uses transistor features smaller than the width of a DNA strand, which measures about 2.5 nanometers across. The chip itself is about the size of a fingernail but holds almost 100 billion transistors, and the company expects it could enter markets as early as the next five years. In a statement released today, IBM said the new chip features nearly twice the density of its 2-nanometer chip, released in 2021. According to an accompanying technical report, the chip also demonstrated up to 70% greater energy efficiency than its predecessor. In designing the chip, researchers developed an “entirely new transistor architecture” called nanostack, which “vertically stacks and staggers transistors” to enable IBM’s 0.7-nanometer chip technology, IBM explained. A section of the chip seen with a transmission electron microscope. Credit: IBM “With our new nanostack architecture, we’re not just making smaller transistors,” Jay Gambetta, director of IBM Research, said in the statement. “We’re reinventing how chips are built to deliver dramatically more power and energy efficiency.”
Smaller and smaller Semiconductor chips enable things like computers, home appliances, communications, and transportation devices. In 1965, Intel co-founder Gordon Moore surmised that transistor capacities evolved at a predictable and consistent rate. Specifically, all things considered, the number of transistors on a semiconductor chip would double about every two years. For a while, the so-called Moore’s Law held rather well—until, that is, things hit a literal wall.
“Moore’s Law was never meant to last forever,” according to a blog post by the Massachusetts Institute of Technology’s (MIT) Computer Science and Artificial Intelligence Lab. “Transistors can only get so small and, eventually, the more permanent laws of physics get in the way.” That is, as companies try to cram more transistors into smaller chips, new advances in transistor technology take longer than two years, so Moore’s Law has been over since at least 2016, Charles Leiserson, a computer scientist at MIT, said in the blog. Accordingly, the issue now is to consider how improvements in chip performance fit into a longer-term picture, Willy Shih, an economist at Harvard Business School, said in an explainer.
Reaching atomic levels In that sense, IBM’s latest chip represents an inventive approach for bypassing the limits of physical scaling. Specifically, two wafers with nanosheet-style transistors are glued together like a sandwich to vertically stack two layers of transistors, and related technical assessments suggested that the wafer stacking was flexible and scalable enough to support real computation, Huiming Bu, vice president of IBM’s silicon technology research team, said in a press briefing on the chip. Researcher holding IBM’s sub-1 nm node wafer. Credit: IBM That said, this chip isn’t quite ready for manufacturing just yet. The company’s goal is to enter production in the next five years, but there’s still work to be done. For instance, Bu pointed out that the team was still working on pathways to prevent thermal noise or integration into existing systems in the high-performance computing community. “From my perspective, I hope to see it be as successful as the 2-nanometer [chip] and become the industry platform,” Gambetta said during the briefing. “And as we see with AI and classical computing in general, we are only seeing more and more consumption.” #IBM #Crosses #Computings #Biggest #Barriers #Worlds #Sub1 #Nanometer #ChipIBM,Semiconductors,transistors")
![IBM Crosses One of Computing’s Biggest Barriers With World’s First Sub-1 Nanometer Chip
In a major breakthrough, IBM revealed the world’s first semiconductor chip technology built on a sub-1 nanometer chipmaking process. For comparison, the process uses transistor features smaller than the width of a DNA strand, which measures about 2.5 nanometers across. The chip itself is about the size of a fingernail but holds almost 100 billion transistors, and the company expects it could enter markets as early as the next five years. In a statement released today, IBM said the new chip features nearly twice the density of its 2-nanometer chip, released in 2021. According to an accompanying technical report, the chip also demonstrated up to 70% greater energy efficiency than its predecessor. In designing the chip, researchers developed an “entirely new transistor architecture” called nanostack, which “vertically stacks and staggers transistors” to enable IBM’s 0.7-nanometer chip technology, IBM explained. A section of the chip seen with a transmission electron microscope. Credit: IBM “With our new nanostack architecture, we’re not just making smaller transistors,” Jay Gambetta, director of IBM Research, said in the statement. “We’re reinventing how chips are built to deliver dramatically more power and energy efficiency.”
Smaller and smaller Semiconductor chips enable things like computers, home appliances, communications, and transportation devices. In 1965, Intel co-founder Gordon Moore surmised that transistor capacities evolved at a predictable and consistent rate. Specifically, all things considered, the number of transistors on a semiconductor chip would double about every two years. For a while, the so-called Moore’s Law held rather well—until, that is, things hit a literal wall.
“Moore’s Law was never meant to last forever,” according to a blog post by the Massachusetts Institute of Technology’s (MIT) Computer Science and Artificial Intelligence Lab. “Transistors can only get so small and, eventually, the more permanent laws of physics get in the way.” That is, as companies try to cram more transistors into smaller chips, new advances in transistor technology take longer than two years, so Moore’s Law has been over since at least 2016, Charles Leiserson, a computer scientist at MIT, said in the blog. Accordingly, the issue now is to consider how improvements in chip performance fit into a longer-term picture, Willy Shih, an economist at Harvard Business School, said in an explainer.
Reaching atomic levels In that sense, IBM’s latest chip represents an inventive approach for bypassing the limits of physical scaling. Specifically, two wafers with nanosheet-style transistors are glued together like a sandwich to vertically stack two layers of transistors, and related technical assessments suggested that the wafer stacking was flexible and scalable enough to support real computation, Huiming Bu, vice president of IBM’s silicon technology research team, said in a press briefing on the chip. Researcher holding IBM’s sub-1 nm node wafer. Credit: IBM That said, this chip isn’t quite ready for manufacturing just yet. The company’s goal is to enter production in the next five years, but there’s still work to be done. For instance, Bu pointed out that the team was still working on pathways to prevent thermal noise or integration into existing systems in the high-performance computing community. “From my perspective, I hope to see it be as successful as the 2-nanometer [chip] and become the industry platform,” Gambetta said during the briefing. “And as we see with AI and classical computing in general, we are only seeing more and more consumption.” #IBM #Crosses #Computings #Biggest #Barriers #Worlds #Sub1 #Nanometer #ChipIBM,Semiconductors,transistors](https://i1.wp.com/gizmodo.com/app/uploads/2026/06/nanostacking-ibm-sub-nm-chip-1280x720.jpg?ssl=1 "IBM Crosses One of Computing’s Biggest Barriers With World’s First Sub-1 Nanometer Chip
In a major breakthrough, IBM revealed the world’s first semiconductor chip technology built on a sub-1 nanometer chipmaking process. For comparison, the process uses transistor features smaller than the width of a DNA strand, which measures about 2.5 nanometers across. The chip itself is about the size of a fingernail but holds almost 100 billion transistors, and the company expects it could enter markets as early as the next five years. In a statement released today, IBM said the new chip features nearly twice the density of its 2-nanometer chip, released in 2021. According to an accompanying technical report, the chip also demonstrated up to 70% greater energy efficiency than its predecessor. In designing the chip, researchers developed an “entirely new transistor architecture” called nanostack, which “vertically stacks and staggers transistors” to enable IBM’s 0.7-nanometer chip technology, IBM explained. A section of the chip seen with a transmission electron microscope. Credit: IBM “With our new nanostack architecture, we’re not just making smaller transistors,” Jay Gambetta, director of IBM Research, said in the statement. “We’re reinventing how chips are built to deliver dramatically more power and energy efficiency.”
Smaller and smaller Semiconductor chips enable things like computers, home appliances, communications, and transportation devices. In 1965, Intel co-founder Gordon Moore surmised that transistor capacities evolved at a predictable and consistent rate. Specifically, all things considered, the number of transistors on a semiconductor chip would double about every two years. For a while, the so-called Moore’s Law held rather well—until, that is, things hit a literal wall.
“Moore’s Law was never meant to last forever,” according to a blog post by the Massachusetts Institute of Technology’s (MIT) Computer Science and Artificial Intelligence Lab. “Transistors can only get so small and, eventually, the more permanent laws of physics get in the way.” That is, as companies try to cram more transistors into smaller chips, new advances in transistor technology take longer than two years, so Moore’s Law has been over since at least 2016, Charles Leiserson, a computer scientist at MIT, said in the blog. Accordingly, the issue now is to consider how improvements in chip performance fit into a longer-term picture, Willy Shih, an economist at Harvard Business School, said in an explainer.
Reaching atomic levels In that sense, IBM’s latest chip represents an inventive approach for bypassing the limits of physical scaling. Specifically, two wafers with nanosheet-style transistors are glued together like a sandwich to vertically stack two layers of transistors, and related technical assessments suggested that the wafer stacking was flexible and scalable enough to support real computation, Huiming Bu, vice president of IBM’s silicon technology research team, said in a press briefing on the chip. Researcher holding IBM’s sub-1 nm node wafer. Credit: IBM That said, this chip isn’t quite ready for manufacturing just yet. The company’s goal is to enter production in the next five years, but there’s still work to be done. For instance, Bu pointed out that the team was still working on pathways to prevent thermal noise or integration into existing systems in the high-performance computing community. “From my perspective, I hope to see it be as successful as the 2-nanometer [chip] and become the industry platform,” Gambetta said during the briefing. “And as we see with AI and classical computing in general, we are only seeing more and more consumption.” #IBM #Crosses #Computings #Biggest #Barriers #Worlds #Sub1 #Nanometer #ChipIBM,Semiconductors,transistors")
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